IoT SuperServer SYS-211SE-31A

DEMAND_SYS-211SE-31A
DEMAND_SYS-211SE-31A
DEMAND_SYS-211SE-31A
DEMAND_SYS-211SE-31A
DEMAND_SYS-211SE-31A
DEMAND_SYS-211SE-31A
DEMAND_SYS-211SE-31A
  • Form Factor 2U Rackmount
  • Supported CPUs Intel Xeon Scalable 4th Gen
  • Intel Xeon Scalable 5th Gen
  • CPU Sockets 3
  • Max Supported Memory
    2 TB  DDR5  ECC Supported
  • Power Supply
    2000 W    Redundant

Key Applications

  • Multi-Access Edge Computing
  • Flex-RAN, Open-RAN vBBU
  • Telecom DRAN, CRAN, and Edge Core Application
  • Enterprise Edge Computing

Key Features

  • Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  • Single Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon Scalable processors (per node)
  • 8 DIMMs; Up to 2TB 3DS ECC DDR5-5600MT/s; RDIMM / LRDIMM (per node)
  • 2 PCIe Gen5 x16 FHHL slots and 1 PCIe Gen5 x16 HHHL slot (per node)
  • 2 NVMe M.2 2280/22110 (per node)
  • 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node)
  • Front-access 2000W AC Redundant Power Supplies (per system)
  • Operating Temperature 0°C to 35°C (32°F to 95°F) CPU TDP max 300W
  • Operating Temperature 0°C to 55°C (32°F to 131°F) CPU TDP max 205W
  • Operating Temperature -5°C to 55°C (23°F to 131°F) CPU TDP max 205W (Short Term)

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More Specifications

  • CPU Manufacturer  Intel
  • Total Drives Supported  6
  • Dimensions  430 mm Depth
  • Dimensions  449 mm Width
  • Dimensions  88 mm Height
  • Manufacturer  Supermicro
  • Motherboard Model  X13
  • Product Model  SYS-211SE-31A
  • DIMM Type  RDIMM